S9+HS
| Device type | BGA, CSP, QFN, QFP, SQFP, TSOP |
|---|---|
| Device size | 2X2~50X50 (mm) (Depends on condition) |
| Device thickness | 0.6~5.0 (mm) |
| Temp range | Up to 150 degrees |
| Max contact force | 85kgf (480kgf option) |
| Index time | Less than 0.35sec |
| UPH | 16000 |
| Test Site | Single, Dual, Quad, Octal, 16ch |
| Jam rate | 1/20000 |
| Temp accuracy | ＋50℃～＋90℃・・・±2℃ ＋90℃～＋130℃・・・±3℃ ＋130℃～＋150℃・・・±5℃ |