S1 Compact 3
| Device type | BGA, CSP, QFN, BCC, QFP, TSOP |
|---|---|
| Device size | 1X1~50X50 (mm) |
| Device thickness | 0.4~5.0 (mm) |
| Temp range | -40 to 150 degrees |
| Max contact force | 85kgf (higher contact force op available) |
| Index time | 6.6sec |
| UPH | S1P:±1℃ |
| Test Site | Single ~ |
| Jam rate | 1/1000 |
| Temp accuracy | ±3℃（-40 ～ +125℃）、±5℃（+125 ～ +175℃） ＊SP1は±1 |